Customization: | Available |
---|---|
Condition: | New |
Certification: | CE |
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Power requirement | 110/220VAC 1-phase |
Power max. | 2KW |
Heating zone quantity | upper3/down3 |
Conveyor speed | 15 - 60 cm/min (6 - 23 inch/min) |
Standard Max Height | 30mm |
Temperature control range | Room temperature~300 degree celsius |
Temperature control accuracy | ±0.2 degree celsius |
Temperature distribution deviation | ±1 degree celsius |
Soldering width | 260 mm (10 inch) |
Length process chamber | 680 mm (26.8 inch) |
Heat-up time | approx. 15 min |
Dimensions | 1020 x 507 x 350 mm (L x W x H) |
Packing Size | 112x 62x 56cm |
N.W./ G.W. | 49KG/ 64kg (without working table) |
1. Full convection, excellent soldering performance.
2. 6 zones design, light and compact.What is reflow soldering
The basic process behind reflow or to provide its full name, infra-red reflow soldering requires that solder paste is applied to the relevant areas of the board.
The components are then placed, and then the assembly is passed through a tunnel where the board is heated in a controlled manner so that the solder paste melts and the components are electrically secured to the printed circuit board.
Using reflow soldering technology it is possible to reliably solder surface mount components, and particularly those with very fine pitch leads. This makes it ideal for use with the components used in mass produced electronics products.
What is a brief SMT process
Preparation board/ solder paste→ Screen printing→ Component placement→ Component inspection→ Reflow soldering→ Cleaning→ Solder joint inspection→ Cicuit testing→ Packaging → Finish.