SMD Reflow Oven (T5L) Hot Air Soldering Equipment for PCBA Soldering

• Customization: Available
• Condition: New
• Certification: CE
• Model NO.: T5L
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Application: SMD Soldering
• Model: T5l
• Zone Qty: 5
• Peak Power: 7
• Working Power: 3kw
• Voltage: 380 220V
• Width of Conveyor: 300mm
• Component Max. Height: 25-55mm
• Outsize of Machine: 1800X600X1200mm
• Transport Package: Wooden Case Packing
• Specification: 5 heating zone
• Trademark: Neoden
• Origin: Zhejiang
• HS Code: 8515809090
• Production Capacity: 200sets/M

Product Description

SMD reflow oven- 5 heating zone version T5L

Used for electric components soldering in SMT production line, LED, high precision IC, scale board solering assembly.
 

Product Parameters

Parameters	T8L	T5L	T8(desktop)	T5(desktop)	T5S(desktop)
L*W*H(mm)	2100x712x1220	1800x600x1220	2100x712x500	1800x600x500	1400x555x375
N.W.(KG)	230	160	180	130	100
Peak power(KW)	11.6	7.8	11.6	7.8	5.8
Working power(KW)	5	3.5	5	3.5	2
Voltage(V)	380/220	380/220	380/220	380/220	380/220
Conveyor width(mm)	300	300	300	300	300
Available height(mm)	25	25	25	25	25
Max.conveyor speed (mm/min)	1000	1000	1000	1000	1000
Heating area length (mm)	1210	1000	1210	1000	900
T5  Five zones	First/ Forth:Fast preheating zone Second:Drying zone Third/Fifth:Soldering zone Fourth/Fifth:Bottom-side heating zone (Each zones adapts independent heating/cooling control ways,cooling zone belongs to strong wind refrigerating system.)
T8  Eight zones	First/Fifth:Fast preheating zone Second/Third/Sixth/Seventh:Drying zone Forth/Eighth:Soldering zone Fifth/Sixth/Seventh/Eighth:Bottom-side heating zone (Each zones adapts independent heating/cooling control ways,cooling zone belongs to strong wind refrigerating system.)

Overseas Exhibition

 

FAQ

What is reflow soldering

The basic process behind reflow or to provide its full name, infra-red reflow soldering requires that solder paste is applied to the relevant areas of the board.
The components are then placed, and then the assembly is passed through a tunnel where the board is heated in a controlled manner so that the solder paste melts and the components are electrically secured to the printed circuit board.
Using reflow soldering technology it is possible to reliably solder surface mount components, and particularly those with very fine pitch leads. This makes it ideal for use with the components used in mass produced electronics products.

What is a brief SMT process

Preparation board/ solder paste→ Screen printing→ Component placement→ Component inspection→ Reflow soldering→ Cleaning→ Solder joint inspection→ Cicuit testing→ Packaging → Finish.